Enabling Optimized Testing of the Next Generation of Technology
Testing of a chip occurs both at wafer level and package level. These different phases require different types of device interface boards: a Probe Card (PC) with an integrated probe head and needles that contact the wafer before packaging, and the Final Test (FT) board that includes sockets specific to the packaged integrated circuits shape and size. DIS Tech provides the expertise to design, manufacture, and assemble these types of boards, as well as Prober Interface Boards (PIBs).
Discover FusionLink
What we do
DIS Tech is focused on optimizing performance, quality, schedule, and total cost for Device Interface Board (DIB) design and manufacturing.
How DIS Tech Can Help Your Business
DIS Tech provides you with local interface design expert resources and offers “turn-key” solutions for your interfacing needs, allowing your engineering team to focus on test development.
With over 500 global support personnel, we are a trusted partner providing local design for new device introductions.
DIS Tech design means our customers have a predictable hardware release schedule for mass production readiness. If your goal is to optimize performance, quality, schedule, and total test cost for Device Interface Board (DIB) design and manufacturing, your best option is DIS Tech.